Die Attach Paste for
SiC Power Semiconductor
Packages and Modules

TERABOND®

High Thermal Conductivity Non-Pressure Sintering Type
Die Bonding Material for SiC Power Semiconductor Packages

The World’s Only Die Bonding Material
Applicable to Chips Larger than 8x8mm2
Using Non-Pressure Sintering Method

High Performance/Low Cost Manufacturing Competitiveness
Compared to Global Competitors

Less-Pressure, High Thermal Conductivity,
High Density of Sintering, Low Modulus

Die attach paste based on Teraon’s proprietary composite material
formulation design technology and production system

Thermal Cycle Tests

Void & Delamination Test Results

  • • Void within 5%(Based on evaluation of
    global power module)

  • • No cracks or delamination observed during thermal cycle testing

    • Low modulus(<15GPa)

Sintering Test Results

  • • Low resistance at the level of 4x10-6 Ωcm

    • High thermal conductivity of 150W/mK or higher

    • Excellent sintering density, electrical conductivity, and adhesive strength

  • • Reduced Rds(on) by approximately 5% compared to pressured film-type die bonding material
    (Based on test results using the same package)

  • Excellent
    Processability

    • ·

      Dispensing and Screen Printing Possible

    • ·

      Viscosity and Thixotropic Index Adjustable

    • ·

      Workable for 24+ Hours

    • ·

      Storage Stability of 6+ Months

    • ·

      Applicable to Various Chip Sizes:
      From 1x1mm2 to 8x8mm2

Superior Dispensing and Printing Processability

Open Time 0hr 1hr 2hr
Printing
Die Attach
Open Time 0hr 1hr 2hr
Dispensing
Die Attach

Manufacturing Process

  • 01.

    Mixing

  • 02.

    3 Roll Milling

  • 03.

    Printing or Dispensing

  • 04.

    Die Attach

  • Die Attach Paste
    Analysis Process

    Teraon ensures high reliability and stability in
    every step of the R&D and production quality
    through its in-house analysis process for
    physical and durability evaluation. Teraon also
    provides consultation and evaluation services
    for analysis of physical and durability properties.

    • Die Shear Strength Test

    • C-Scan

Die Shear Tester

Adhesion strength between the Die and the junction area of semiconductor components (such as DBC interface) plays a crucial role. Teraon quantitatively measures the adhesion strength using Die Shear Tester to enhance reliability and stability in the manufacturing process.

C-Scan

We analyze voids, cracks, and other properties at the interface of semiconductor packages using non-destructive evaluation. This helps us analyze die attach behavior after thermal treatment and performance after environmental testing.

LFA
(Laser Flash Analysis)

Analysis of thermal conductivity characteristics, a key property of Die Attach Paste’s heat dissipation performance, to optimize the heat transfer capability of various Die Attach Paste products and prevent heat generation issues in the product.

DSC
(Differential Scanning Calorimetry)

Understanding the thermal behavior of Die Attach Paste composition and setting the optimal material properties design and heat treatment process for different compositions through DSC analysis.

DMA
(Dynamic mechanical Analysis)

Analysis of modulus, a key property of durability against thermal and mechanical stress between chips and substrates, to ensure high reliability of the product.

Product Features

The use of non-pressurized, low modulus silver low-temperature sintering technology ensures minimal
chip damage, enables the application of large-sized chips and achieves other excellent properties.

  • Excellent thermal
    conductivity

  • Superior bonding
    strength

  • High energy
    efficiency

  • Low modulus

    • ·

      Excellent thermal conductivity(>150W/mK), superior bonding strength
      (>4kgf/1x1mm2), low modulus(<15GPa)

    • ·

      The non-pressurized sintering method reduces RDS(ON) values for
      improved energy efficiency

    • ·

      5% reduction in RDS(ON) compared to film-type chip bonding materials
      from competitive companies that use pressurized methods

    • ·

      Short process time: 90 minutes(170°C/15min -> 250°C/60min)

TERABOND®-2020H TDS TERABOND®-1020H TDS
Thermal Conductivity(W/mk) > 150 < 150
Electrical Resistivity ( X 10-6 Ωcm) < 5.0 < 6.0
Die Shear Strength (Kgf/1*1mm2) > 4.0 > 2.0
Modulus(Gpa, 25℃) < 15 < 10
Process Temperature(℃) 170 ~ 250 170 ~ 250
Die Cover Size 1x1 ~ 8x8mm2 1x1 ~ 8x8mm2
Workable Surface Ag, Au, Cu, etc. Ag, Au, Cu, etc.
Application Process Screen Printing/Dispensing Screen Printing/Dispensing
Applications Die Attach
Die Top Attach
Spacer Attach 		Die Attach
Die Top Attach
Spacer Attach
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