Nano Carbon
Film Heater
for EV
Nano Carbon Film Heater
VESTATON®
for EV
VESTATON® generates heat with a very low power, while offering excellent comfort for drivers
and space efficiency. Furthermore, it offers a fast ramp, a prevention for low-temperature burn,
and energy efficiency, enhancing both practicality and convenience of electric vehicles.
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Hands Off Detection for
Autonomous Driving
with VESTATON®The Hands-Off Detection system employing a steering wheel with an integrated heater enables a fast and safe transition to autonomous driving.
Leveraging capacitive sensing technology, our system ensures reliable detection of presence of driver’s hands on the steering wheel.
We offer a multi-zone design for customization. The development of the system is expected to be completed in 2024.-
HANDS ON
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HANDS OFF
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Improving Energy
Efficiency For EVTeraon is actively conducting research and development with the goal of achieving a 50% reduction in heating power consumption and over 15% improvement in winter driving range for electric vehicles.
Lithium-ion batteries experience performance, efficiency, and lifespan degradation during the winter season, and the automotive market is facing increasingly stringent regulations on exhaust emissions and fuel efficiency.
In the rapidly growing green car market, Teraon provides effective solutions to improve heating and battery efficiency. -
Die Attach Paste for
SiC Power Semiconductor
Packages and Modules
Die Attach Paste for
SiC Power Semiconductor
Packages and Modules
TERABOND®
High Thermal Conductivity Non-Pressure Sintering Type
Die Bonding Material for SiC Power Semiconductor Packages
The World’s Only Die Bonding Material
Applicable to Chips Larger than 8x8mm2
Using Non-Pressure Sintering Method
High Performance/Low Cost Manufacturing Competitiveness
Compared to Global Competitors
Less-Pressure, High Thermal Conductivity,
High Density of Sintering, Low Modulus
Die attach paste based on Teraon’s proprietary composite material
formulation design technology and production system
Thermal Cycle Tests
Void & Delamination Test Results
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• Void within 5%(Based on evaluation of
global power module) -
• No cracks or delamination observed during thermal cycle testing
• Low modulus(<15GPa)
Sintering Test Results
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• Low resistance at the level of 4x10-6 Ωcm
• High thermal conductivity of 150W/mK or higher
• Excellent sintering density, electrical conductivity, and adhesive strength
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• Reduced Rds(on) by approximately 5% compared to pressured film-type die bonding material
(Based on test results using the same package)
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Excellent
Processability-
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Dispensing and Screen Printing Possible
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Viscosity and Thixotropic Index Adjustable
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Workable for 24+ Hours
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Storage Stability of 6+ Months
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Applicable to Various Chip Sizes:
From 1x1mm2 to 8x8mm2
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Superior Dispensing and Printing Processability
| Open Time | 0hr | 1hr | 2hr |
|---|---|---|---|
| Printing |
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| Die Attach |
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| Open Time | 0hr | 1hr | 2hr |
|---|---|---|---|
| Dispensing |
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| Die Attach |
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Die Attach Paste
Analysis ProcessTeraon ensures high reliability and stability in
every step of the R&D and production quality
through its in-house analysis process for
physical and durability evaluation. Teraon also
provides consultation and evaluation services
for analysis of physical and durability properties.-
Die Shear Strength Test
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C-Scan
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| Die Shear Tester |
Adhesion strength between the Die and the junction area of semiconductor components (such as DBC interface) plays a crucial role. Teraon quantitatively measures the adhesion strength using Die Shear Tester to enhance reliability and stability in the manufacturing process. |
|---|---|
| C-Scan |
We analyze voids, cracks, and other properties at the interface of semiconductor packages using non-destructive evaluation. This helps us analyze die attach behavior after thermal treatment and performance after environmental testing. |
|
LFA (Laser Flash Analysis) |
Analysis of thermal conductivity characteristics, a key property of Die Attach Paste’s heat dissipation performance, to optimize the heat transfer capability of various Die Attach Paste products and prevent heat generation issues in the product. |
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DSC (Differential Scanning Calorimetry) |
Understanding the thermal behavior of Die Attach Paste composition and setting the optimal material properties design and heat treatment process for different compositions through DSC analysis. |
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DMA (Dynamic mechanical Analysis) |
Analysis of modulus, a key property of durability against thermal and mechanical stress between chips and substrates, to ensure high reliability of the product. |
Product Features
The use of non-pressurized, low modulus silver low-temperature sintering technology ensures minimal
chip damage, enables the application of large-sized chips and achieves other excellent properties.
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Excellent thermal
conductivity -
Superior bonding
strength -
High energy
efficiency -
Low modulus
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Excellent thermal conductivity(>150W/mK), superior bonding strength
(>4kgf/1x1mm2), low modulus(<15GPa) -
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The non-pressurized sintering method reduces RDS(ON) values for
improved energy efficiency -
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5% reduction in RDS(ON) compared to film-type chip bonding materials
from competitive companies that use pressurized methods -
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Short process time: 90 minutes(170°C/15min -> 250°C/60min)
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| TERABOND®-2020H TDS | TERABOND®-1020H TDS | |
|---|---|---|
| Thermal Conductivity(W/mk) | > 150 | < 150 |
| Electrical Resistivity ( X 10-6 Ωcm) | < 5.0 | < 6.0 |
| Die Shear Strength (Kgf/1*1mm2) | > 4.0 | > 2.0 |
| Modulus(Gpa, 25℃) | < 15 | < 10 |
| Process Temperature(℃) | 170 ~ 250 | 170 ~ 250 |
| Die Cover Size | 1x1 ~ 8x8mm2 | 1x1 ~ 8x8mm2 |
| Workable Surface | Ag, Au, Cu, etc. | Ag, Au, Cu, etc. |
| Application Process | Screen Printing/Dispensing | Screen Printing/Dispensing |
| Applications |
Die Attach Die Top Attach Spacer Attach |
Die Attach Die Top Attach Spacer Attach |
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